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1. product pro?le 1.1 general description planar schottky barrier diodes with an integrated guard ring for stress protection. encapsulated in small surface-mounted device (smd) plastic packages. 1.2 features n low forward voltage n small smd plastic packages n low capacitance 1.3 applications n ultra high-speed switching n voltage clamping n line termination n reverse polarity protection 1.4 quick reference data [1] pulse test: t p 300 m s; d 0.02. 1ps76sb21; BAT721 series schottky barrier diodes in small packages rev. 06 21 december 2006 product data sheet table 1. product overview type number package con?guration nxp jeita 1ps76sb21 sod323 sc-76 single BAT721 sot23 - single BAT721a sot23 - dual common anode BAT721c sot23 - dual common cathode BAT721s sot23 - dual series table 2. quick reference data symbol parameter conditions min typ max unit per diode i f forward current - - 200 ma v r reverse voltage - - 40 v v f forward voltage i f = 200 ma [1] - - 550 mv
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 2 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 2. pinning information [1] the marking bar indicates the cathode. table 3. pinning pin description simpli?ed outline symbol 1ps76sb21 1 cathode [1] 2 anode BAT721 1 anode 2 not connected 3 cathode BAT721a 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1), anode (diode 2) BAT721c 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1), cathode (diode 2) BAT721s 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 2 1 sym001 12 006aaa144 12 3 006aaa436 1 3 2 n.c. 006aaa144 12 3 006aaa439 12 3 006aaa144 12 3 006aaa438 12 3 006aaa144 12 3 006aaa437 12 3
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 3 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 3. ordering information 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china 5. limiting values table 4. ordering information type number package name description version 1ps76sb21 sc-76 plastic surface-mounted package; 2 leads sod323 BAT721 - plastic surface-mounted package; 3 leads sot23 BAT721a BAT721c BAT721s table 5. marking codes type number marking code [1] 1ps76sb21 s1 BAT721 l7* BAT721a l8* BAT721c l9* BAT721s l0* table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per diode v r reverse voltage - 40 v i f forward current - 200 ma i fsm non-repetitive peak forward current half sine wave; jedec method; t p = 8.3 ms -1a t j junction temperature - 125 c t amb ambient temperature - 65 +150 c t stg storage temperature - 65 +150 c
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 4 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 6. thermal characteristics [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 7. thermal characteristics symbol parameter conditions min typ max unit per diode r th(j-a) thermal resistance from junction to ambient in free air [1] 1ps76sb21 - - 450 k/w BAT721 - - 500 k/w BAT721a - - 500 k/w BAT721c - - 500 k/w BAT721s - - 500 k/w table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v f forward voltage i f =10ma [1] - - 300 mv i f = 100 ma [1] - - 420 mv i f = 200 ma [1] - - 550 mv i r reverse current v r =30v --15 m a v r = 30 v; t j = 100 c --3 ma c d diode capacitance v r = 0 v; f = 1 mhz - 40 50 pf
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 5 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values t amb =25 c; f = 1 mhz fig 3. diode capacitance as a function of reverse voltage; typical values 006aaa689 1 10 10 2 10 3 i f (ma) 10 - 1 v f (mv) 0 600 400 200 (1) (2) (3) (4) 006aaa690 i r (ma) v r (v) 040 30 10 20 10 - 4 10 - 2 1 10 10 - 5 10 - 3 10 - 1 10 - 6 (1) (2) (3) (4) 40 30 v r (v) c d (pf) 01020 10 2 10 1 mbk574
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 6 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 8. package outline 9. packing information [1] for further information and the availability of packing methods, see section 13 . fig 4. package outline sod323 (sc-76) fig 5. package outline sot23 03-12-17 dimensions in mm 0.25 0.10 0.45 0.15 2.7 2.3 1.8 1.6 0.40 0.25 1.1 0.8 1.35 1.15 1 2 04-11-04 dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 12 3 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 1ps76sb21 sod323 4 mm pitch, 8 mm tape and reel -115 -135 BAT721 sot23 4 mm pitch, 8 mm tape and reel -215 -235 BAT721a BAT721c BAT721s
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 7 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 10. soldering dimensions in mm fig 6. re?ow soldering footprint sod323 (sc-76) dimensions in mm fig 7. wave soldering footprint sod323 (sc-76) msa433 1.65 0.50 (2 ) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste msa415 1.40 4.40 5.00 1.20 2.75 preferred transport direction during soldering solder lands solder resist occupied area
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 8 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages dimensions in mm fig 8. re?ow soldering footprint sot23 dimensions in mm fig 9. wave soldering footprint sot23 msa439 1.00 0.60 (3x) 1.30 1 2 3 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 solder lands solder resist occupied area solder paste msa427 4.00 4.60 2.80 4.50 1.20 3.40 3 21 1.20 (2x) preferred transport direction during soldering solder lands solder resist occupied area
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 9 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 11. revision history table 10. revision history document id release date data sheet status change notice supersedes 1ps76sb21_BAT721_ser_6 20061221 product data sheet - 1ps76sb21_BAT721 _ser_5 modi?cations: ? amended t ab le 10 re vision histor y 1ps76sb21_BAT721_ser_5 20061205 product data sheet - BAT721_series_4 1ps76sb21_3 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? this data sheet is a combination of data sheets BAT721_series_4 and 1ps76sb21_3. ? t ab le 1 product o v er vie w : added ? section 1.2 f eatures : amended ? section 1.3 applications : amended ? t ab le 2 quic k ref erence data : added ? t ab le 5 mar king codes : for 1ps76sb21 amended ? t ab le 5 mar king codes : enhanced table note section ? t ab le 6 limiting v alues : indication per diode added ? t ab le 6 limiting v alues : for 1ps76sb21 i fsm condition amended ? t ab le 6 limiting v alues : t amb ambient temperature added ? t ab le 7 ther mal char acter istics : indication per diode added ? t ab le 7 : r th(j-a) thermal resistance from junction to ambient condition amended ? t ab le 8 char acter istics : indication per diode added ? t ab le 8 char acter istics : reference to t ab le note 1 amended ? t ab le 8 : for 1ps76sb21 c d minimum value changed to typical value ? figure 1 and 2 : amended ? figure 4 and 5 : superseded by minimized package outlines ? section 9 p ac king inf or mation : added ? section 10 solder ing : added ? section 12 legal inf or mation : updated BAT721_series_4 20040315 product speci?cation - BAT721_series_3 1ps76sb21_3 20040126 product speci?cation - 1ps76sb21_2
1ps76sb21_BAT721_ser_6 ? nxp b.v. 2006. all rights reserved. product data sheet rev. 06 21 december 2006 10 of 11 nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 1ps76sb21; BAT721 series schottky barrier diodes in small packages ? nxp b.v. 2006. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 21 december 2006 document identifier: 1ps76sb21_BAT721_ser_6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 packing information. . . . . . . . . . . . . . . . . . . . . . 6 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 contact information. . . . . . . . . . . . . . . . . . . . . 10 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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